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our masslam service offers a wide variety of solutions for pcb manufacturers, not just over capacity. we provide a “cost effective” service with “exceptional yields”. we can offer from prototype to series, the masslam product can be manufactured on the full range of emc materials. through sensible investment in processing equipment, emc can process 2 mil inner-layers, image and etch 2 mil “line & space”, laminate up to 28-layers, whilst maintaining perfect layer to layer registration. for added value service we offer, plating, blind & buried vias, none conductive via fill, copper fill, laser drilling, and sequential lamination. for more information, please contact our masslam sales or local service centers.

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technology capabilities

feature

standard

advanced

maximum layer count

standard ml

26

28

sequential

2 16b 2

2 18b 2

maximum working size

ml drill

617 x 541 mm

700 x 541 mm

ml drill to o/l aoi

617 x 541 mm

630 x 541 mm

board thickness

ml drill

0.25 - 5.08 mm

up to 6.0 mm

ml drill to o/l aoi

0.25 - 2.4 mm

up to 3.0 mm

maximum cu thickness

innerlayer

3 oz

4 oz

outerlayer

2 oz

3 oz

minimum core thickness

 

0.075 mm

0.05 mm

minimum line/space

innerlayer

0.075/0.075 mm

0.05/0.05 mm

outerlayer

0.1/0.1 mm

0.05/0.1 mm

line width control

 

± 15%

± 8%

layer registration

 

0.125 mm

0.075 mm

drilling

mechanical

0.2 mm

0.15 mm

laser

0.1 mm

0.075 mm

aspect ratio (pth)

 

1 : 8

1 : 10

special support

via fill (conductive & non-conductive)

y

y

stacked / stagged microvias

y

y

quote

welcome to use our on-line quote tooling. please click on the link below, or have questions please do not hesitate to contact us.

place order

please send your request order to the emc mailbox and you will be contacted by the specialist within two working days。
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